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specification part no. : mt1:7$ .0mm round led lamp observe precaution for handling electro static sensitive devices attention 3 northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www .marktechopto.com
ver.: 01 date: 2013/08/02 page: 1 /5 description this white lamp is made with ingan/sapphire chip and water clear epoxy resin. notes: 1. all dimensions are in mm. 2. tolerance is 0.25mm unless otherwise noted. description led chip part no. material emitting color lens color MT3003N-WT-A i ngan/sapphire white w ater clear ak 5.1 1.5 typ. 2.540.1 24.0 min. 0.5 max. 3.0 MT3003N-WT-A 3.0mm round led lamp
ver.: 01 date: 2013/08/02 page: 2 /5 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 120 mw reverse voltage v r 5 v d.c. forward current if 30 ma reverse (leakage) current ir 50 ?a peak current(1/10duty cycle,0.1ms pulse width.) if(peak) 100 ma operating temperature range topr -25 to +85
storage temperature range tstg -40 to +100
soldering temperature(1.6mm from body) tsol dip soldering : 260
for 5 sec. hand soldering : 350
for 3 sec. electrostatic discharge esd 6000 v electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous intensity i v if=20ma 3850 8000 mcd forward voltage vf if=20ma 3.2 4.0 v cie chromaticity coordinates:x axis x if=20ma 0.31 cie chromaticity coordinates:y axis y if=20ma 0.30 reverse (leakage) current ir vr=5v 50 a viewing angle 21/2 if=20ma 30 deg notes:1. the datas tested by is tester. 2. customers special requirements are also welcome. MT3003N-WT-A 3.0mm round led lamp
ver.: 01 date: 2013/08/02 page: 3 /5 chromaticity coordinates speci fications for bin grading: color ranks(if=20ma.ta=25
) bin rank bin rank x 0.27 0.28 0.291 0.281 x 0.296 0.304 0.315 0.307 a1 y 0.265 0.282 0.273 0.256 b5 y 0.307 0.319 0.311 0.298 x 0.281 0.291 0.302 0.292 x 0.307 0.315 0.326 0.318 a2 y 0.256 0.273 0.265 0.248 b6 y 0.298 0.311 0.303 0.29 x 0.28 0.288 0.299 0.291 x 0.304 0.312 0.323 0.315 b1 y 0.282 0.294 0.286 0.273 b7 y 0.319 0.331 0.323 0.311 x 0.291 0.299 0.31 0.302 x 0.315 0.323 0.334 0.326 b2 y 0.273 0.286 0.277 0.265 b8 y 0.311 0.323 0.315 0.303 x 0.288 0.296 0.307 0.299 x 0.312 0.322 0.333 0.323 b3 y 0.294 0.307 0.298 0.286 c1 y 0.331 0.348 0.34 0.323 x 0.299 0.307 0.318 0.31 x 0.323 0.333 0.344 0.334 b4 y 0.286 0.298 0.29 0.277 c2 y 0.323 0.34 0.332 0.315 notes:x.y tolereanceeach bin limit is ?0.01. chromaticity coordinates & bin grading diabram: b8 b1 a1 a2 b2 b4 b3 b5 b6 b7 c1 c2 MT3003N-WT-A 3.0mm round led lamp
ver.: 01 date: 2013/08/02 page: 4 /5 typical electrical / optica l characteristics curves : white led spectrum vs. wavelength relative response wavelength(nm) applied voltage (v) forward current vs.applied voltage forward current if(ma) 10 20 40 30 50 2.0 2.6 3.0 3.4 3.8 4.2 forward current (ma) forward current vs. luminous intensity forward current vs. ambient temperature 0 204060 100 80 forward current if(ma) 10 20 40 30 50 temperature ( )
radiation diagram 80 90 60 70 50 30 40 0.1 0.5 0.7 0.8 0.3 1.0 0.9 0.4 0.2 0.6 0 10 20 0.0 10.0 20.0 30.0 2000 4000 6000 8000 10000 relative luminous intensity MT3003N-WT-A 3.0mm round led lamp
ver.: 01 date: 2013/08/02 page: 5 /5 precautions: take note of the following in use of led 1. temperature in use since the light generated inside the led needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessi ve vibration to the resins and terminals at h igh temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-130
. at a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. if external force or stress is applied at that time, it may cause a wire rupture. 2. soldering please be careful on the following at soldering. after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), (1) soldering measurements: distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) dip soldering : pre-heat: 90
max. (backside of pcb), within 60 seconds. solder bath: 260 ? 5
(solder temperature), within 5 seconds. (3) h and soldering: 350
max. (temperature of soldering iron tip), within 3 seconds. 3. insertion pitch of the led leads and pitch of mounting holes need to be same. 4. others since the heat resistant ability of the led re sin is low, smd components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp insertion due to a production process reason, make s ure not to apply external force, stress, and excessive vibration to the led and follow the con ditions below. ba king temperature: 120
max. bak ing time: within 60 seconds. if soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the led to normal temperature. MT3003N-WT-A 3.0mm round led lamp

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